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Single-Die-Level MEMS Post-Processing for Prototyping CMOS-Based Neural Probes Combined with Optical Fibers for

Gabor Orban1, Alberto Perna1, Matteo Vincenzi1

  • 1Microtechnology for Neuroelectronics Laboratory, Fondazione Istituto Italiano di Tecnologia, Via Morego 30, 16163 Genova, Italy.

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|February 27, 2026
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Summary

This study presents a novel micro-electromechanical systems (MEMS) post-processing workflow for complementary metal-oxide-semiconductor (CMOS) dies, enabling advanced neural probes for high-resolution brain activity monitoring. The developed method enhances biosensor fabrication for improved neurological research.

Keywords:
SiNAPS-base neural probeartifact-freebiosensors prototypingcomplementary metal–oxide–semiconductor and micro-electromechanical systems technologies (CMOS–MEMS technology)high-density electrophysiologymultimodal recordingsphotoelectric shield

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Area of Science:

  • Neuroscience
  • Materials Science
  • Electrical Engineering

Background:

  • Miniaturized biosensors integrating complementary metal-oxide-semiconductor (CMOS) and micro-electromechanical systems (MEMS) offer high spatiotemporal resolution for neural monitoring.
  • Standard CMOS wafer-level fabrication is costly, and multi-project wafer (MPW) runs present challenges for MEMS post-processing on small dies due to material and geometric incompatibilities.

Purpose of the Study:

  • To develop a MEMS post-processing workflow adaptable for CMOS dies, facilitating surface modification and layout shaping for intracortical biosensing.
  • To create a high-density neural probe for simultaneous electrophysiological recordings and optogenetic studies.

Main Methods:

  • Optimized spray-coating photolithography to overcome lithographic limitations on small substrates, ensuring reliable material patterning and lift-off.
  • Fabricated a 512-channel neural probe (SiNAPS technology) with integrated optical fibers and a photoelectric shield.
  • Conducted optical bench testing for light-shielding effectiveness and in vivo experiments for electrophysiological measurements.

Main Results:

  • The optimized photolithography successfully patterned diverse materials on CMOS dies, suppressing edge effects.
  • The fabricated neural probe demonstrated over 96% light-shielding effectiveness against optical stimulation.
  • In vivo experiments validated the probe's capacity for high-resolution electrophysiological recordings.

Conclusions:

  • The presented MEMS post-processing workflow enables advanced fabrication of CMOS-integrated neural probes for sophisticated neuroscience applications.
  • The developed neural probe facilitates high-fidelity neural recording and optogenetic manipulation, advancing brain-computer interfaces and neurological research.