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Updated: Jun 25, 2026

Atom Probe Tomography Studies on the CuIn,GaSe2 Grain Boundaries
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Buried Interface Ionic Engineering Enables Defect Passivation and Efficient Cu2AgBiI6 Solar Cells.

Zhixin Jin1, Xinjie Wang1, Yalun Li1

  • 1School of Science, Yanshan University, Qinhuangdao, China.

Small (Weinheim an Der Bergstrasse, Germany)
|March 6, 2026
PubMed
Summary

Lead-free copper bismuth iodide (CABI) solar cells show improved performance using a novel buried interface passivation strategy. This method addresses microscopic loss mechanisms, enhancing efficiency for eco-friendly photovoltaics.

Keywords:
Cu2AgBiI6defect passivationion migrationlead‐free perovskitespotassium compensation

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Area of Science:

  • Materials Science
  • Renewable Energy
  • Solid-State Chemistry

Background:

  • Lead-free perovskite-inspired materials like copper bismuth iodide (Cu$_{2}$AgBiI$_{6}$, CABI) offer sustainable alternatives for photovoltaics.
  • Microscopic loss mechanisms currently limit the performance of CABI-based solar cells.

Purpose of the Study:

  • To investigate the microscopic loss mechanisms in CABI films.
  • To develop a passivation strategy to enhance CABI solar cell performance.

Main Methods:

  • Depth-resolved chemical profiling to analyze film composition.
  • First-principles calculations and Density Functional Theory (DFT) to study defect behavior.
  • Fabrication and characterization of CABI solar cells with a buried interface treatment.

Main Results:

  • Observed depth-dependent copper distribution in CABI films, indicating mobility and redistribution.
  • Identified copper vacancies (V$_{Cu}$) as deep recombination centers.
  • Demonstrated that a buried KCl interface layer passivates V$_{Cu}$ defects, enhancing device performance.

Conclusions:

  • Copper mobility and V$_{Cu}$ defects are key loss mechanisms in CABI.
  • Buried interface ionic passivation with KCl is an effective strategy to improve CABI solar cells.
  • This approach shows potential for other multicomponent ionic semiconductors.