Enhancing Accuracy and Interfacial Adhesion in PEEK-Based Conformal Electronics Fabricated via Hybrid Additive...

Area of Science:

• Materials Science and Engineering
• Additive Manufacturing
• Surface Chemistry

Background:

• Hybrid additive manufacturing, combining FDM and LAM, is crucial for 3D conformal electronics.
• Existing methods face challenges in pattern accuracy and interfacial bonding strength.
• Polyetheretherketone (PEEK) is a key material for conformal electronics fabrication.

Purpose of the Study:

• To address poor pattern accuracy and low interfacial bonding strength in PEEK-based conformal electronics.
• To investigate precursor decomposition mechanisms under laser irradiation.
• To develop dual optimization strategies for enhanced fabrication.

Main Methods:

• Comparative study of precursor decomposition (Pd(OAc)2 vs. PdCl2) under UV picosecond laser irradiation.
• Improved LAM with directional gas flow-assisted laser activation and solvent optimization.
• DMAc cleaning and KH550 silane coupling agent grafting for interfacial enhancement.

Main Results:

• Pd(OAc)2 showed more efficient decomposition, enhancing copper deposition.
• High-precision copper lines (50 μm width, 60 μm spacing) achieved via optimized LAM.
• Interfacial adhesion strength increased from 3.3 to 29.4 MPa through dual reinforcement (mechanical interlocking and chemical bonding).

Conclusions:

• Dual optimization strategies significantly improve PEEK-based conformal electronics fabrication.
• Achieved high pattern accuracy and dramatically enhanced PEEK-Cu interfacial adhesion.
• Validated performance through complex circuit fabrication and antenna testing, advancing applications.