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Towards universal multi-dimensional parallelization communications by direct diverse fiber/3D/2D chip hybrid
Kang Li1,2,3, Chengkun Cai1,2,3, Guofeng Yan1,2,3
1Wuhan National Laboratory for Optoelectronics and School of Optical and Electronic Information, Huazhong University of Science and Technology, Wuhan, China.
Nature Communications
|March 11, 2026
Summary
Space-division multiplexing (SDM) enables higher fiber capacity. This study integrates fiber and chip technologies for seamless mode conversion, achieving 30 Tbit/s transmission across multiple fiber types.
Area of Science:
- Optoelectronics
- Photonics
- Telecommunications
Background:
- Space-division multiplexing (SDM) is crucial for increasing optical fiber capacity.
- Existing SDM technologies include few-mode fibers (FMFs), multi-core fibers (MCFs), and orbital angular momentum fibers (OAMFs).
- Integrating SDM fibers with photonic integrated circuits faces mode-field mismatch challenges.
Purpose of the Study:
- To develop fiber-chip couplers for seamless mode-field conversion.
- To construct a fiber-chip-fiber system compatible with various SDM fiber types.
- To demonstrate a high-capacity, multi-dimensional parallel communication architecture.
Main Methods:
- Hybrid integration of fibers, 3D, and 2D chips to create diverse fiber-chip couplers.
- Development of large-scale, multifunctional 2D silicon chips for system integration.
- Construction of a fiber-chip-fiber system supporting FMF, MCF, OAMF, and single-mode fibers.
Main Results:
- Achieved seamless mode-field conversion between fibers and chips.
- Successfully integrated various SDM fibers with 2D silicon photonic chips.
- Demonstrated a parallel communication system with 288 channels (8 spatial modes x 36 wavelengths).
- Attained a data transmission capacity of 30 Tbit/s.
Conclusions:
- Established a universal multi-dimensional parallelization communication architecture.
- Paved the way for next-generation multi-dimensional data transmission and management.
- Overcame fiber-chip compatibility challenges for scalable SDM systems.
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