Optimizing Greenhouse Gas Emission Quantification and Assessing Mitigation Effectiveness in Semiconductor...

Area of Science:

• Environmental Science
• Climate Change
• Industrial Ecology

Background:

• Fluorinated greenhouse gases (F-GHGs) from semiconductor manufacturing are a growing climate concern.
• Localized data on F-GHG emissions and abatement is limited, hindering effective climate strategies.

Purpose of the Study:

• To develop an improved accounting model for F-GHG emissions in the semiconductor industry.
• To assess the mitigation potential of various abatement strategies.
• To provide localized emission data for Shanghai's semiconductor sector.

Main Methods:

• Developed an enhanced accounting model incorporating new emission sources and experimentally measured destruction and removal efficiencies (DREs).
• Established gas usage coefficients based on wafer size and process type.
• Applied the model to Shanghai's semiconductor industry for 2022 and projected emissions to 2035 under different scenarios.

Main Results:

• Estimated 3.35 Mt CO2e emissions for Shanghai's semiconductor sector in 2022, with process gases and electricity as major contributors.
• Measured DREs resulted in emission estimates 7.4-23.0 times higher than IPCC defaults, indicating significant underestimation by current standards.
• Indirect emissions share increased with wafer size, and plasma abatement showed high DREs but produced concerning NOx byproducts.

Conclusions:

• Localized accounting models are crucial for accurate F-GHG assessment in the semiconductor industry.
• Significant emission reductions (37.49-77.69%) are achievable through enhanced gas abatement and low-carbon electricity.
• Future strategies must address both direct process gas emissions and indirect electricity-related emissions, considering byproducts of abatement technologies.