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Hybrid LTCC-Polyimide Approach for High-Sensitivity Mechanical Sensing Applications
Fares Tounsi1,2, Nesrine Jaziri2, Mahsa Kaltwasser2
1SMALL Group, ICTEAM Institute, Université Catholique de Louvain, 1348 Louvain-la-Neuve, Belgium.
Sensors (Basel, Switzerland)
|March 14, 2026
Summary
This study introduces a novel hybrid Low-Temperature Co-Fired Ceramic (LTCC)/Kapton platform for advanced mechanical sensors. It achieves high sensitivity and mechanical compliance by integrating flexible polyimide with LTCC for tunable RF components.
Area of Science:
- Materials Science
- Electrical Engineering
- Mechanical Engineering
Background:
- Traditional Low-Temperature Co-Fired Ceramic (LTCC) sensors face limitations in miniaturization and flexibility due to rigid multilayer structures.
- Existing LTCC sensor designs struggle to achieve high mechanical compliance and sensitivity simultaneously.
Purpose of the Study:
- To develop a novel hybrid LTCC/Kapton platform for high-sensitivity mechanical sensing.
- To enable mechanically tunable RF passive components by overcoming the limitations of conventional LTCC sensors.
- To demonstrate a fabrication process for a compliant and robust hybrid sensor platform.
Main Methods:
- Integration of a flexible polyimide membrane onto an LTCC substrate using electroplated indium pillars.
- Creation of tunable inductance via metal-shielding proximity effects.
- Creation of tunable capacitance through force-controlled air-gap modulation in a metal-insulator-metal configuration.
- Utilizing 3D surface profiling and impedance measurements for characterization.
Main Results:
- Achieved a 48% inductance tuning range with a sensitivity of 0.715 nH/mN.
- Demonstrated a 36% capacitance tuning range with a sensitivity of 47.3 fF/mN at 1 MHz.
- Fabrication process ensures precise gap control, high compliance, and structural robustness.
Conclusions:
- The hybrid LTCC/Kapton platform offers a compact, scalable solution for high-sensitivity mechanical sensors.
- The developed platform is suitable for mechanically reconfigurable RF components in harsh environments and adaptive electronics.
- This approach overcomes the rigidity and thickness constraints of traditional LTCC sensors.

