Related Experiment Video
Updated: Mar 15, 2026

Subsurface Defect Localization by Structured Heating Using Laser Projected Photothermal Thermography
Published on: May 15, 2017
Defect-Intent Ambiguity Addressing for Training-Free Deterministic PCB Defect Localization via Template Selection and
Saiyan Saiyod1, Woottichai Nonsakhoo1, Zhengping Li1
1Hardware-Human Interface and Communications Laboratory (H2I-Comm Lab), Department of Computer Science, College of Computing, Khon Kaen University, Khon Kaen 40002, Thailand.
Abstract:
Automated optical inspection (AOI) for printed circuit boards (PCBs) requires localizing small, sparse defects under illumination drift and minor placement misalignment, while supporting fast, auditable pass/fail decisions. This paper presents a training-free, reference-based digital image processing framework with no learning/training stage that compares each defective query image with a small library of defect-free reference templates (for the same PCB layout/revision) using a small set of interpretable control parameters. A reference is selected by coarse-to-fine matching (fast pre-screening followed by SSIM refinement on a central region), and an optional global alignment is applied only when it increases SSIM to limit defect-driven over-correction. Defects are highlighted by a defect-likelihood field that fuses an SSIM-derived structural dissimilarity map with a normalized absolute-difference map, followed by connected-component extraction to produce confidence-ranked bounding boxes. The method achieves Precision = 0.9663, Recall = 0.9987, and F1 = 0.9822 at the best-F1 operating point (0.149 false positives per image). Under the adopted box-matching protocol, average precision reaches 0.984. Precision-recall and FROC curves are reported to support threshold selection under different false-alarm budgets.
More Related Videos
10:14Chromatographic Fingerprinting by Template Matching for Data Collected by Comprehensive Two-Dimensional Gas Chromatography
Published on: September 2, 2020
11:14Comprehensive Characterization of Extended Defects in Semiconductor Materials by a Scanning Electron Microscope
Published on: May 28, 2016
Related Concept Videos
Imperfections in Crystal Structure: Non-Stoichiometric Defects
Mismatch Repair
Types of Errors: Detection and Minimization
Absolute error in a measurement is the numerical difference from the true or central value. Relative error is the ratio between absolute error and the true or central value, expressed as a percentage.
Errors can be classified by source, magnitude, and sign. There are three types of errors: systematic, random, and gross.
Systematic or...
Imperfections in Crystal Structure: Point, Line and Plane Defects