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Updated: Mar 16, 2026

Accumulation and Analysis of Cuprous Ions in a Copper Sulfate Plating Solution
Published on: March 20, 2019
Interpretable ML-DFT Framework for Performance Prediction and Structure-Activity Relationship Analysis of Acidic
Bo Yang1, Wenmin Liao1, Yue Kong1
1College of Materials Engineering, North China Institute of Aerospace Engineering, Langfang 065000, PR China.
This study introduces a machine learning (ML) and density functional theory (DFT) framework to rapidly discover novel copper electroplating levelers. Five superior levelers were identified, with one outperforming the industrial standard.
Area of Science:
- Materials Science
- Computational Chemistry
- Electrochemistry
Background:
- High-performance levelers are essential for microelectronic copper electroplating.
- Current development is limited by expensive experimental screening and poorly understood structure-activity relationships (SAR).
Purpose of the Study:
- To develop an integrated machine learning (ML) and density functional theory (DFT) framework for rapid discovery of novel electroplating levelers.
- To identify key molecular descriptors governing leveling efficacy.
Main Methods:
- Established a dataset using experimental Dissolution Peak Decrease Amount (DPDA) and DFT-calculated adsorption energies (Eads).
- Employed ML models (XGBoost Regression, CART) to predict DPDA and Eads for 521 prescreened molecules.
- Utilized Pearson correlation and SHAP analyses to identify key molecular descriptors.
Main Results:
- Successfully predicted DPDA and Eads for a large set of molecules, identifying five superior novel levelers (Res-1 to Res-5).
- Res-5 demonstrated significantly superior performance compared to the industrial standard Janus Green B (JGB).
- Identified electrophilic molecular backbone and N-N functional group interactions as critical for leveling efficacy.
Conclusions:
- The integrated ML-DFT framework provides an efficient screening tool for high-performance levelers.
- The study offers new insights into molecular SAR at electrochemical interfaces.
- Novel levelers with potential industrial applications were discovered.
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