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Updated: Mar 23, 2026

Drawing and Hydrophobicity-patterning Long Polydimethylsiloxane Silicone Filaments
Published on: January 7, 2019
Self-Assembled Filament Layers in Drying Sessile Droplets: From Morphology to Electrical Conductivity
Johannes Schöttner1, Qingguang Xie1, Gaurav Nath1
1Helmholtz Institute Erlangen-Nürnberg for Renewable Energy (IET-2), Forschungszentrum Jülich, Cauerstraße 1, 91058 Erlangen, Germany.
Controlling filament deposition from evaporating droplets is key for printed electronics. Reaction-limited evaporation promotes uniform, conductive networks, unlike diffusion-limited evaporation which causes edge accumulation.
Area of Science:
- Materials Science
- Fluid Dynamics
- Nanotechnology
Background:
- Controlling filament deposition (nanowires, nanotubes) from evaporating droplets is crucial for flexible sensors and printed electronics.
- Deposit morphology significantly impacts functional properties like electrical conductivity, but remains difficult to control.
Purpose of the Study:
- To numerically investigate how filament length, stiffness, and concentration influence deposition patterns during droplet drying.
- To compare reaction-limited and diffusion-limited evaporation regimes and their effects on filament arrangement.
Main Methods:
- Numerical investigation of filament deposition during droplet evaporation.
- Comparison of reaction-limited and diffusion-limited evaporation kinetics.
- Analysis of filament length, stiffness, and concentration effects on deposition patterns.
Main Results:
- Diffusion-limited evaporation leads to the 'coffee-ring effect' and non-uniform networks.
- Reaction-limited evaporation suppresses edge accumulation, favoring centered conductive deposits.
- Filament alignment varies spatially: tangential at the contact line, radial intermediately, and random centrally.
- Longer filaments promote tangential alignment and reduce edge accumulation.
- Tuning evaporation regimes significantly lowers percolation thresholds and increases conductivity exponents.
Conclusions:
- Evaporation kinetics fundamentally alter filament arrangement and conductive network formation.
- Optimizing evaporation regimes provides guidelines for enhancing conductivity in printed electronics.
- This work quantifies the relationship between evaporation kinetics and microstructure for material design.
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