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Molecularly Bridged Heterointerface Engineering: Designing Transparent, Wear-Resistant, Hard yet Flexible

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Summary

This study introduces a novel bilayer transparent film combining polyhedral oligomeric silsesquioxane (POSS) and colorless polyimide (CPI). This advanced material offers exceptional hardness, flexibility, and wear resistance for flexible electronics.

Keywords:
bilayer‐structured filmcoatingcolorless polyimide (CPI)foldable cover window (FCW)polyhedral oligomeric silsesquioxane (POSS)

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Area of Science:

  • Materials Science
  • Polymer Science
  • Nanotechnology

Background:

  • Flexible optoelectronics require robust transparent films, but current polymers lack hardness and glass is brittle.
  • Existing materials present a trade-off between hardness, flexibility, and durability.

Purpose of the Study:

  • To develop a transparent film with superior hardness, flexibility, and wear resistance for flexible optoelectronic applications.
  • To engineer a bilayer structure with covalent bonding at the interface for enhanced performance.

Main Methods:

  • Fabrication of a bilayer film using a polyhedral oligomeric silsesquioxane (POSS) coating (PT10MMA) on a colorless polyimide (CPI) substrate.
  • Utilizing photo- or thermal-crosslinking and interfacial covalent bonding for material synthesis.
  • Characterization of mechanical properties, optical transmittance, and durability under various stress conditions.

Main Results:

  • The developed film exhibits glass-like hardness (7H) and polymer-like flexibility (no creases after 200,000 bending cycles).
  • Achieved high optical transmittance (>89.6%) and excellent wear resistance (>500 abrasion cycles).
  • Demonstrated creep-free performance up to 50°C, indicating thermal stability.

Conclusions:

  • The bilayer film with engineered covalent interfacial bonding overcomes limitations of existing transparent materials.
  • This material provides a promising solution for durable and high-performance flexible optoelectronic devices.
  • Synergistic properties emerge from the combination of POSS and CPI layers, enhancing overall functionality.