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Flexible Piezoresistive Sensor with Multi-layer Electrospun Structure for Ultra-sensitive and Wide-range Pressure
Zhongyun Zhang1, Zhou Liu1, Chengqi Liu1
1Institute of Smart City and Intelligent Transportation, Southwest Jiaotong University, Chengdu 611756, China.
Abstract:
Piezoresistive flexible pressure sensors have gained significant attention in medical monitoring and industrial systems owing to their high flexibility, compact form factor, and broad application prospects. However, achieving both high sensitivity and a wide detection range while maintaining low fabrication cost remains a major challenge. Herein, we report a high-performance flexible piezoresistive sensor with a coupled electrospun multilayer microstructure (CEMP), fabricated via a customized template-assisted electrospinning strategy that ensures precise control over fiber morphology and uniformity. The sensor employs CNT/TPU electrospun membranes, where CNTs form a robust conductive network and TPU enhances mechanical integrity. A dual-layer fiber-coupled structure enables multisegment linear piezoresistive response, significantly boosting sensitivity and detection range. Additionally, a porous PVP electrospun layer atop the interdigital electrodes improves interfacial bonding and structural stability through synergistic physical and chemical interactions. The resulting sensor demonstrates remarkable performance, characterized by ultrahigh sensitivity (up to 5904.6 kPa-1), a broad detection window (0-749 kPa), and outstanding long-term durability under repeated loading for over 8000 cycles. These capabilities highlight the sensor's applicability in advanced industrial and biomedical systems, paving the way for its future integration into intelligent, adaptive sensing platforms.
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