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Updated: Mar 27, 2026

High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods
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Co-packaged electronics with microfluidics for direct-to-package cooling.

Henry A Martin1,2,3, Zihan Zhang4, Mahad Saeed5,6

  • 1Chip Integration Technology Center (CITC), Nijmegen, The Netherlands. henry.martin@tno.nl.

Communications Engineering
|March 26, 2026
PubMed
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This summary is machine-generated.

Direct-to-package (D2P) liquid cooling embeds microchannels in the package, overcoming fabrication challenges. This approach significantly reduces junction temperatures and thermal resistance for high-power systems.

Area of Science:

  • Materials Science
  • Mechanical Engineering
  • Electrical Engineering

Background:

  • High heat flux and temperatures in power semiconductors necessitate advanced liquid cooling.
  • Direct-to-chip (D2C) cooling offers benefits but faces fabrication hurdles.
  • Current methods often require large coolant volumes and complex integration.

Purpose of the Study:

  • To introduce and evaluate a novel direct-to-package (D2P) liquid cooling strategy.
  • To address the fabrication challenges associated with direct-to-chip microchannel integration.
  • To demonstrate a compact, efficient, and scalable cooling solution for high-power semiconductor devices.

Main Methods:

  • Embedding microchannels directly within the semiconductor package substrate.

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  • Implementing a D2P cooling architecture to eliminate the need for thermal interface materials.
  • Testing the system's thermal performance under high heat flux conditions (up to ~625 W cm⁻²).

    • Main Results:

    • Achieved high heat flux dissipation with minimal coolant volume (~2-4 mL).
    • Demonstrated significantly lower junction temperatures (~6-7x lower than air cooling, ~2-3x lower than heat sink cooling).
    • Obtained a high coefficient of performance with an effective global Nusselt number > 10.

    Conclusions:

    • D2P liquid cooling integration is a viable and effective solution for thermal management in high-power systems.
    • This approach bypasses complex microfabrication processes required for D2C cooling.
    • The D2P method offers a scalable, energy-efficient, and compact cooling alternative.