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Updated: Mar 30, 2026

Characterization of Thermal Transport in One-dimensional Solid Materials
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Efficient foam-based thermal interface material functionalized with MWCNTs for CPU cooling applications: thermal

Nehal Ali1, Badawi Anis2,3, Mohamed Elhadary4

  • 1Department of Engineering Physics and Mathematics, Faculty of Engineering, Tanta University, Tanta, Egypt. nehal.ali@f-eng.tanta.edu.eg.

Scientific Reports
|March 28, 2026
PubMed

Keywords:
ModelingPVF/MWCNT foamsTIMThermal analysis

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