Multifunctional 3D MXene@MDCF Nanoarchitectures via Hierarchical Networks Self-Assembled Strategy Achieving Superior...

To address the critical challenges of heat accumulation and electromagnetic interference in high-power electronic packaging, which severely restrict the performance stability and service life of electronic devices. This study develops a multifunctional epoxy-based composite (MXene@MDCF/EP) through synergistically designed electrostatic self-assembly. By leveraging the opposite surface potentials of MXene (-39.5 mV) and melamine-derived carbon foam (MDCF, +23.4 mV), we constructed a 3D hierarchical network where MXene nanosheets are uniformly anchored onto MDCF scaffolds. This unique architecture simultaneously resolves MXene's stacking limitations and enhances impedance matching. At a low filler loading of 10 wt.%, the composite achieves exceptional electromagnetic wave absorption with a minimum reflection loss (RL_min) of -55.76 dB and a maximum effective absorption bandwidth (EAB_max) of 5.20 GHz, outperforming most reported MXene-based absorbers at reduced filler content. The dual-pathway thermal network elevates thermal conductivity to 0.602 W·m^-1·K^-1 (213.5% higher than pure EP), enabling efficient heat dissipation. Furthermore, the composite exhibits superior flame retardancy, reducing peak heat release rate and total heat release by 25.7% and 30.46%, respectively, through the formation of dense carbon layers. This work provides a cost-effective strategy for multifunctional electronic packaging materials with integrated wave-absorption, thermal management, and flame-retardant properties.