Reconfigurable Spoof Plasmonic Skyrmion Electronics for Deformation-Invariant Multimode Sensing

Area of Science:

• Materials Science
• Electrical Engineering
• Nanotechnology

Background:

• Wearable electronics face challenges from motion artifacts and miniaturization, particularly in dynamic environments like skin interfaces.
• Existing sensors often struggle with stability and sensitivity in flexible applications.

Purpose of the Study:

• To introduce a novel flexible multimode sensor overcoming limitations of current wearable technology.
• To demonstrate the potential of reconfigurable spoof localized surface plasmon (SLSP) skyrmions for motion artifact-free sensing.

Main Methods:

• Integration of multi-capacitor loading with reconfigurable SLSP skyrmions on a flexible polyimide substrate.
• Systematic investigation of circular, square, and heart-shaped topological configurations.
• Validation of sensor performance through simulation and experimental testing under various deformation conditions.

Main Results:

• Achieved an ultrahigh quality factor (Q-factor) of 164.29 in a deep-subwavelength footprint (λ/14.5 diameter).
• Demonstrated topological robustness with consistent resonant frequencies across different skyrmion shapes.
• Exhibited remarkable bending stability and enhanced average normalized sensitivity from 2.5% to 3.3% via capacitance loading.

Conclusions:

• The SLSP skyrmion sensor offers a new paradigm for motion artifact-free, flexible sensing with ultra-compact form factors and high Q-factor.
• This technology holds significant potential for next-generation wearable electronics, including electronic skin and conformal health monitors.