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Updated: Apr 13, 2026

Scanning Electron Microscopic Evaluation of Surface Defects of Remover Retreatment File After Single and Multiple Uses
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Evaluation method of surface roughness using SEM.

Kei Nagatomo1, Takeshi Otsuka1, Yuhei Nakajima1

  • 1JEOL Ltd., 3-1-2 Musashino, Akishima, Tokyo 196-8558, Japan.

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|April 12, 2026
PubMed
Summary

This study validates a corrected scanning electron microscope-photometric stereo (SEM-PS) method for assessing surface roughness in electroplated coatings. The enhanced SEM-PS method offers accurate, non-destructive, wide-area surface morphology evaluation.

Keywords:
Roughness evaluationSEM-PS methodSegmented backscattered electron detector

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Area of Science:

  • Materials Science
  • Surface Metrology
  • Analytical Chemistry

Background:

  • Surface roughness is critical for material properties in semiconductor and manufacturing applications.
  • Conventional scanning electron microscope-photometric stereo (SEM-PS) methods have limited height accuracy due to artifacts like backscattered electron (BSE) deflection.

Purpose of the Study:

  • To investigate the feasibility of assessing surface roughness using a corrected SEM-PS method with a segmented BSE detector.
  • To enhance measurement precision by introducing distortion and deflection corrections for SEM-PS analysis.

Main Methods:

  • Developed and applied a corrected SEM-PS method utilizing a segmented BSE detector.
  • Prepared four electroless Ni-P plated samples with varying roughness.
  • Performed height calibration using atomic force microscopy (AFM) and applied corrections for BSE deflection and distortion.

Main Results:

  • The corrected SEM-PS method demonstrated good agreement with AFM measurements, especially on gentle slopes.
  • Consistent roughness trends were observed across all tested electroless Ni-P samples.
  • The method proved effective for evaluating intrinsic surface morphology.

Conclusions:

  • The corrected SEM-PS method provides a non-destructive, wide-area approach for reliable surface roughness evaluation.
  • This technique offers advantages for plating characterization and contamination-insensitive surface analysis.
  • Further research may address sensitivity to surface contamination.