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Gate-All-Around Nanowire Field-Effect Transistors: A Historical Perspective
Lei Tang1, Peidong Yang1,2,3,4
1Department of Chemistry, University of California, Berkeley, Berkeley, California 94720, United States.
Nano Letters
|April 13, 2026
Summary
Transistor evolution from 2D MOSFETs to gate-all-around nanowire FETs is key for sub-3 nm nodes. This review highlights gate-all-around nanowire FETs and future Angstrom Era technologies.
Area of Science:
- Semiconductor device physics
- Materials science
- Electrical engineering
Background:
- Technological scaling of semiconductor devices is critical for the advancement of the electronics industry.
- Traditional 2D planar metal-oxide-semiconductor field-effect transistors (MOSFETs) have limitations for further miniaturization.
Purpose of the Study:
- To review the historical development of transistor architectures, focusing on gate-all-around nanowire (GAANW) FETs.
- To highlight the advantages of GAANW transistors for sub-3 nm technology nodes and beyond.
- To discuss future transistor technologies for the Angstrom Era.
Main Methods:
- Literature review and conceptual analysis of transistor evolution.
- Comparative analysis of different transistor architectures (planar, FinFET, GAANW).
- Technological roadmap projection for future semiconductor devices.
Main Results:
- Gate-all-around nanowire (GAANW) FETs offer significant advantages over planar and FinFET devices for continued scaling.
- GAANW transistors have progressed from concept to industrial adoption.
- Complementary FETs (CFETs) and 2D semiconductor-based FETs are identified as key technologies for the Angstrom Era.
Conclusions:
- GAANW FETs are crucial for next-generation semiconductor technology below 3 nm.
- Continued innovation in transistor design, including CFETs and 2D materials, is necessary to achieve the Angstrom Era.
- This perspective aims to guide future research in advanced transistor development.
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