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Molecular Mechanism of Disulfide Bond Healing and Network Repair in Epoxy Vitrimers Revealed by Quantum Chemical and
Tomoya Uyama1, Naoki Kishimoto2, Yutaka Oya1
1Department of Materials Science and Technology, Tokyo University of Science, Tokyo 125-8585, Japan.
Abstract:
We investigate covalent bond healing and mechanical property recovery in a cross-linked epoxy vitrimer containing disulfide bonds by combining quantum chemical calculations and molecular dynamics simulations. Quantum chemical calculations based on the GRRM method are first performed to explore energetically accessible post-scission recombination pathways of sulfur-centered radicals generated by disulfide bond cleavage. The resulting energetic ordering of bonding configurations is incorporated into molecular dynamics simulations through recombination rules derived from the quantum chemical calculations, allowing assessment of network repair and mechanical response. The results indicate that sulfur-centered radicals can undergo post-scission recombination via transient interactions with the aromatic ring prior to reformation of the disulfide bond. Tensile simulations further show that disulfide bonds preferentially break compared with other covalent bonds in the cross-linked network. Incorporation of the recombination pathways identified by the quantum chemical calculations leads to enhanced bond reformation and partial recovery of mechanical properties compared with a model assuming direct sulfur-sulfur recombination only.
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