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All-solution-processed mid-infrared electrochromics (ASPIRE) for thermoregulation with arbitrary curvatures
Pei-Jan Hung1, Qizhang Li1, Ting-Hsuan Chen1,2
1Pritzker School of Molecular Engineering, University of Chicago, Chicago, IL 60637, USA. pochunhsu@uchicago.edu.
Materials Horizons
|April 16, 2026
Summary
Researchers developed a new fabrication method for mid-infrared electrochromic devices that conform to 3D surfaces. This innovation allows for electrically tunable thermal emission on curved objects, enhancing heat management applications.
Area of Science:
- Materials Science
- Nanotechnology
- Energy
Background:
- Mid-infrared electrochromism is key for managing radiative heat transfer in buildings, industry, and personal devices.
- Current devices on planar substrates limit applications on 3D or curved surfaces due to air gaps and reduced efficiency.
Purpose of the Study:
- To develop an all-solution-processed fabrication method for mid-infrared electrochromic devices on arbitrary 3D surfaces.
- To enable objects to become electrically tunable thermal emitters with full surface conformity.
Main Methods:
- Utilized poly(3,4-ethylenedioxythiophene):polystyrene sulfonate (PEDOT:PSS) for electrochromic and charge-storage layers.
- Employed a heterogeneous mixed ionic-electronic conductor (HNO3-doped carbon nanotubes and hydrogel) for layer separation.
- Developed a layer-by-layer configuration for complete surface conformity and electrochemical stability.
Main Results:
- Achieved an emissivity tunability of 0.195 in the mid-infrared spectrum.
- Demonstrated apparent temperature modulation of 6.1 °C on planar and 2.3 °C on curved surfaces.
- Fabricated conformable electrochromic devices directly on 3D objects.
Conclusions:
- Established a generalizable strategy for outward-facing electrochromic devices on complex geometries.
- Opened new avenues for advanced light and heat management technologies using tunable thermal emitters.
- Overcame limitations of planar devices for applications requiring conformal coverage on 3D structures.
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