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Electrospun Flexible Ceramic Nanofibers: Toward High-Performance Materials for Multifunctional Applications.
Yalin Fan1, Jun Zhang1, Jinqin Ye1
1Beijing Key Laboratory of Advanced Functional Polymer Composites, College of Material Science and Engineering, Beijing University of Chemical Technology, Beijing, China.
Small (Weinheim an Der Bergstrasse, Germany)
|April 17, 2026
Summary
Flexible ceramic nanofibers achieve flexibility through multiscale strain-transfer pathways, not weakened bonds. This enables large deformations for applications in extreme environments.
Area of Science:
- Materials Science
- Nanotechnology
- Ceramics Engineering
Background:
- Ceramic materials are typically rigid and brittle.
- Flexible ceramics are desirable for advanced applications.
- Electrospinning is a key technique for fabricating ceramic nanofibers.
Purpose of the Study:
- To establish a multiscale framework explaining flexibility in electrospun ceramic nanofibers.
- To analyze structure-property relationships and applications of flexible ceramic nanofibers.
- To identify design paradigms and bottlenecks for future flexible ceramic nanofibers.
Main Methods:
- Review of existing literature on electrospun ceramic nanofibers.
- Analysis of multiscale mechanisms contributing to flexibility.
- Systematic discussion of oxide, carbide, and nitride ceramic nanofibers.
- Critical analysis of application performance based on mechanisms.
Main Results:
- Flexibility originates from multiscale strain-transfer pathways, not weakened ceramic bonds.
- Key mechanisms include amorphous-nanocrystalline interfaces, fiber diameter effects, and pore-enabled strain delocalization.
- Synergistic mechanisms allow large deformation and prevent fracture.
- Structure-property relationships and processing strategies are detailed for various ceramic types.
Conclusions:
- Electrospun ceramic nanofibers offer a unique combination of flexibility and stability.
- Understanding multiscale mechanisms is crucial for designing high-performance flexible ceramics.
- Further research is needed to overcome bottlenecks for applications in extreme environments.
