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Engineering Vertically Aligned Boron Nitride Skeletons Bridged by Trace Graphene for High-Performance Thermal
Wei Lin1, Benyuan Wang1, Jian Yan1
1Key Laboratory of Advanced Catalytic Materials and Technology, Advanced Catalysis and Green Manufacturing Collaborative Innovation Center, Changzhou University, Changzhou 213164, Jiangsu Province, China.
ACS Applied Materials & Interfaces
|April 22, 2026
Summary
Researchers developed a new thermal interface material (TIM) using heteroassembly of hexagonal boron nitride (h-BN) and reduced graphene oxide (rGO). This advanced material significantly enhances heat transfer for high-power electronics like 5G and AI systems.
Area of Science:
- Materials Science
- Nanotechnology
- Thermal Engineering
Background:
- High-power density electronics (5G, AI) require efficient thermal management.
- Traditional thermal interface materials (TIMs) have limitations in vertical heat transfer and mechanical properties.
- Randomly arranged fillers in conventional TIMs hinder through-plane thermal conductivity.
Purpose of the Study:
- To develop a novel TIM with enhanced vertical thermal conductivity and mechanical robustness.
- To address the limitations of traditional TIMs in high-power electronic applications.
- To create a scalable and material-efficient route for next-generation TIMs.
Main Methods:
- Synergistic heteroassembly strategy using tannic acid-assisted ball milling and unidirectional freeze-casting.
- Intercalation of modified hexagonal boron nitride (h-BN) into graphene oxide (GO) interlayers.
- High-temperature thermal reduction to form TA-BN/rGO aerogel, followed by silicone rubber impregnation.
Main Results:
- Achieved a highly crystalline TA-BN/rGO aerogel with vertically aligned h-BN and reduced graphene oxide (rGO).
- Composite TIMs demonstrated a through-plane thermal conductivity of 1.45 W m-1 K-1 at 5 wt % filler loading (806% enhancement over silicone gel).
- Superior electrical insulation and mechanical compliance were observed.
Conclusions:
- The developed heteroassembled aerogel structure provides an effective pathway for efficient vertical heat transfer.
- The composite TIMs satisfy the demands of thermal efficiency and operational safety for advanced electronics.
- This work presents a scalable and material-efficient method for next-generation thermal management solutions.
