Suppressing acoustomigration and temperature rise for high-power robust acoustics

Area of Science:

• Materials Science
• Acoustics Engineering
• Electrical Engineering

Background:

• High-frequency acoustic wave transducers are crucial for mobile devices and expanding into interdisciplinary fields.
• Acoustic wave devices face limitations in high-power applications due to self-heating, thermal instability, and acoustomigration.
• Existing interdigital transducer-based surface acoustic wave devices struggle with power density.

Purpose of the Study:

• To propose a novel layered acoustic wave platform to address the limitations of high-power acoustic wave transducers.
• To suppress self-heating, thermal instability, and acoustomigration in acoustic wave devices.
• To enhance the power handling capabilities and thermal management of surface acoustic wave devices.

Main Methods:

• Development of a layered acoustic wave platform with a quasi-infinite multifunctional top layer.
• Redefinition of mechanical and thermal boundary conditions using the proposed layered architecture.
• Experimental validation of the transducer's performance under high-power loads.

Main Results:

• Achieved a 70% reduction in temperature rise compared to conventional devices.
• Demonstrated a temperature coefficient of frequency of -13 ppm/°C.
• Attained an unprecedented threshold power density of 45.61 dBm/mm², over an order of magnitude higher than state-of-the-art counterparts.

Conclusions:

• The proposed layered acoustic wave platform effectively suppresses key mechanisms limiting high-power operation.
• This architecture enables scalable deployment of high-power acoustic wave components in space-constrained hybrid platforms.
• The innovation opens new avenues for functional diversification of acoustic wave transducers in demanding applications.