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Updated: Apr 25, 2026

Comprehensive Characterization of Extended Defects in Semiconductor Materials by a Scanning Electron Microscope
Published on: May 28, 2016
Sample holder development for in-situ EBAC mapping of the uniformity of thin-film conductivity
Isaac Appelquist Løge1,2, Håkon Kristiansen3, Nadia Shardt1
1Department of Chemical Engineering, Norwegian University of Science and Technology (NTNU), Sem Sælands vei 4 (Gløshaugen) 7491 Trondheim, Norway.
Abstract:
Electron beam absorbed current (EBAC) microscopy can provide spatially resolved electrical information that conventional probe methods and local scanning probes often miss in nanoparticulate thin films. Here we present the development of a practical scanning electron microscopy (SEM)-based methodology to qualitatively assess conductivity uniformity and electrical continuity in thin films spanning two electrodes using TiO2 films as a model system. The approach combines a purpose-built insulating holder, readily made without clean-room and advanced lithography access, with embedded electrodes and a measurement configuration to visualize current pathways and identify electrically disconnected regions that may not be apparent from morphology alone. Line scans and 2D maps enable rapid screening of film quality, highlighting cracks, and poor particle connectivity. The workflow is designed for reproducibility and can be adapted to other semiconducting or weakly conducting thin films where microscale continuity is critical to device performance. Fabricate a biasable dual-electrode SEM holder by embedding bent copper plates in an insulating resin body and machining a defined deposition channel (drilled to expose copper + resin in one plane), enabling repeatable electrode gaps and robust external connections for EBAC measurements. Prepare thin films that reliably bridge the electrode gap by using a diluted, well-dispersed nanoparticle suspension (e.g., TiO2 in IPA) and controlled drop-casting into the channel; confirm continuous coverage using standard SEM imaging before electrical mapping. Map conductivity uniformity in situ using EBAC (line scans and 2D maps under applied voltage) to rapidly locate conductive pathways and diagnose electrically disconnected regions that may appear morphologically continuous, providing a reproducible screening workflow adaptable to other weakly conducting thin films.

