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Updated: Jul 2, 2026

An Available Technique for Preparation of New Cast MnCuNiFeZnAl Alloy with Superior Damping Capacity and High Service Temperature
Published on: September 23, 2018
Enhancing ductility in tungsten-based refractory high-entropy alloys through al and cu alloying: A first-principles
Michael Woodcox1, Avik Mahata2
1Material Measurement Laboratory, National Institute of Standards and Technology, 100 Bureau Dr., Gaithersburg, MD postcode, United States.
Abstract:
We employ density functional theory to explore how Al and Cu substitution influence the mechanical properties of the refractory high-entropy alloy MoNbTaW. Replacing W with Al or Cu reduces the alloy's density and alters its electronic structure in distinct ways. Projected density of states and Bader charge analyses indicate that Cu weakens metallic bonding, while Al promotes more directional, covalent-like interactions. These modifications enhance ductility, as evidenced by increases in Poisson's ratio ( ) and the Pugh ratio ( ). Electron localization function results further reveal greater charge delocalization in the alloyed systems, supporting the conclusion that strategic Al and Cu incorporation can improve ductility without compromising thermodynamic stability. These findings provide insight into designing lightweight, ductile, and stable tungsten-based high-entropy alloys for demanding structural applications.

