Orthogonal Monomer Design Enables Sequentially Cured Hybrid Polymers for Ultralow-Dielectric Applications.

Xiaohao Tang1,2, Meng Xie1,2, Rui Xue1,2

  • 1Key Laboratory of Science and Technology on High-Tech Polymer Materials, Institute of Chemistry, Chinese Academy of Sciences, Beijing, P.R. China.

Summary

Researchers developed a novel polymer network using sequential curing methods. This strategy precisely confines silsesquioxane domains, leading to advanced dielectric materials for electronic packaging.