Strengthening the Substrates of Wood Single Lap Joints Using a Novel Hot-Melt Film Adhesive to Mitigate Delamination

Delamination remains a critical limitation in the structural application of wood, particularly in adhesively bonded joints. This study investigates the use of a cyclic olefin-based hot-melt film adhesive (Zeon^® LS-XU) as a thermoplastic interlayer as a means to delay delamination and enhance joint performance. Single lap joints (SLJs) were tested under quasi-static (1 mm/min) and impact (3 m/s) loading to assess strain-rate effects. Six configurations were examined: two reference, two toughened (with an additional 15 mm of adhesive on each overlap side) and two hybrid configurations combining oak (Quercus alba) and pine (Pinus pinaster Aiton) substrates to improve stress wave propagation. A finite element elastic model was developed to analyse stress distributions and explain the superior performance of hybrid joints. Results revealed that the thermoplastic interlayer delayed delamination onset and increased energy absorption, while hybrid configurations achieved more uniform stress distributions and significantly higher strengths under dynamic loading. The most effective configuration, the hybrid joint under impact conditions, represents a strength improvement of approximately 84% of the peak load compared to the pine reference joints. Overall, introducing a thermoplastic interlayer offers an efficient and lightweight strategy to enhance the toughness and reliability of wood joints exposed to variable loading conditions.