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Stage-Wise Curing for Improving the Bonding Strength of Imaging Coupling Devices
Yuwen Xing1,2, Yajie Du1, Miao Chu1
1Institute of Special Glass Fiber, China Building Materials Academy, Beijing 100024, China.
Materials (Basel, Switzerland)
|May 4, 2026
Summary
Stage-wise curing of UV-adhesives improves bonding for optical devices. However, longer intervals between curing stages weaken the bond due to oxygen inhibition, compromising device reliability.
Area of Science:
- Materials Science
- Optical Engineering
- Adhesion Science
Background:
- UV-cured adhesives are crucial for coupling optical components in extreme environments.
- Weak bonding strength is a challenge for charge-coupled devices (CCDs) or complementary metal-oxide semiconductors (CMOS) and tapered optic fiber arrays (TOFAs).
Purpose of the Study:
- To investigate a stage-wise curing process for UV-adhesives to enhance bonding strength.
- To analyze the effect of interval time between curing stages on coupling strength and environmental adaptability.
Main Methods:
- Comparative analysis of single vs. stage-wise curing processes.
- Tensile strength, shear strength, and shock acceleration testing.
- Environmental testing (high/low temperatures).
- Surface morphology and energy-dispersive X-ray spectroscopy (EDS) analysis.
Main Results:
- Stage-wise curing is more efficient than single curing.
- Extending interval time from 5 to 60 minutes decreased shock acceleration by 26.1%, tensile strength by 49.4%, and shear strength by 60.7%.
- Oxygen inhibition during the interval time creates a weak boundary layer, reducing coupling strength.
Conclusions:
- Optimizing interval time in stage-wise curing is critical for maximizing bond strength.
- Understanding oxygen inhibition is key to improving the reliability of coupled imaging devices.
