Fast Analysis of Multilayer Micro-Machined Coupler Based on Mode-Matching Method

Area of Science:

• Terahertz (THz) technology
• Integrated photonics
• Microwave engineering

Background:

• Next-generation terahertz (THz) systems require high-performance components.
• 3D stacked packaging is key for advanced THz transmitters and receivers.
• Waveguide directional couplers are critical for THz device integration.

Purpose of the Study:

• To present an accurate and efficient mode-matching method (MMM) for analyzing branch waveguide couplers.
• To enable rapid analysis of couplers fabricated using silicon-based 3D stacking.
• To offer a faster alternative to traditional finite-element method (FEM) simulations.

Main Methods:

• Utilized the mode-matching method (MMM) for theoretical analysis.
• Developed a silicon-based 3D stacking process for coupler fabrication.
• Validated the MMM through experimental characterization of a 220 GHz waveguide coupler fabricated via deep reactive ion etching (DRIE).

Main Results:

• The proposed MMM provides orders-of-magnitude speed improvement over FEM.
• The method is highly suitable for large-scale uncertainty and statistical error analysis.
• Experimental validation confirmed the accuracy of the MMM for THz waveguide couplers.

Conclusions:

• The MMM is an efficient and accurate tool for analyzing THz waveguide couplers.
• This method accelerates the design and optimization of 3D stacked THz components.
• The validated MMM supports the development of next-generation THz communication systems.