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Heterogeneous Integration of Microelectronics by Self-Assembly
Yingkun Ma1, Karl F Böhringer1
1Department of Electrical and Computer Engineering, University of Washington, Seattle, WA 98195, USA.
Micromachines
|May 4, 2026
Abstract:
As planar CMOS scaling slows, system performance improvements increasingly rely on heterogeneous integration and advanced packaging, shifting cost-per-function pressure onto large-scale assembly and motivating approaches that can deliver both functional diversification ("More-than-Moore") [...].

