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Updated: May 5, 2026

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Heterogeneous Integration of Microelectronics by Self-Assembly

Yingkun Ma1, Karl F Böhringer1

  • 1Department of Electrical and Computer Engineering, University of Washington, Seattle, WA 98195, USA.

Micromachines
|May 4, 2026
PubMed
Summary

System performance gains now depend on advanced packaging and heterogeneous integration as traditional scaling limits are reached. This shift drives innovation in assembly technologies for functional diversification, or "More-than-Moore" approaches.

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