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Silver Conductive Adhesives with Long Pot Life and Stable Electrical-Thermal Performance
Wilson Hou-Sheng Huang1, Jyh-Ferng Yang2, Yi-Cang Lai2
1Center for Continuing Education, National Tsing Hua University, Hsinchu 30013, Taiwan.
Polymers
|May 4, 2026
Summary
This study optimized epoxy-based silver conductive adhesives for flexible electronics, achieving stable electrical and thermal properties with low-temperature curing and long pot life. These findings offer practical guidelines for developing advanced conductive interconnects.
Area of Science:
- Materials Science
- Polymer Chemistry
- Electrical Engineering
Background:
- Epoxy-based silver conductive adhesives are crucial for flexible electronics.
- Optimizing their formulation is key for performance and stability.
- Low-temperature curability is essential for temperature-sensitive substrates.
Purpose of the Study:
- To investigate formulation-property relationships in epoxy-based silver conductive adhesives.
- To correlate rheological behavior, conductive network formation, and electrical-thermal transport.
- To establish a practical formulation design window for specific applications.
Main Methods:
- Systematic variation of silver filler architecture, loading, and organic carrier design.
- Characterization using rotational viscometry, four-point probe, thermal conductivity analysis, and SEM.
- Evaluation of storage stability under ambient conditions (25 °C, 60% RH).
Main Results:
- Formulations demonstrated viscosity variations within 16% after two weeks, indicating good storage stability and extended pot life.
- Normalized volume resistivity and thermal conductivity remained stable, with maximum deviations of ~12% and ~7%, respectively.
- Balanced electrical-thermal performance was achieved via low-temperature curing (~155 °C) without sintering or post-annealing.
Conclusions:
- A practical formulation design window was defined for epoxy-based silver conductive adhesives.
- The study provides material-level guidelines for conductive interconnects on flexible polymer substrates.
- The developed adhesives offer low-temperature curability, long pot life, and robust performance.
