Search research articles

ABOUT JoVE

Overview Leadership Blog JoVE Help Center

AUTHORS

Publishing Process Editorial Board Scope & Policies Peer Review FAQ Submit

LIBRARIANS

Testimonials Subscriptions Access Resources Library Advisory Board FAQ

RESEARCH

JoVE Journal Methods Collections JoVE Encyclopedia of Experiments Archive

EDUCATION

JoVE Core JoVE Business JoVE Science Education JoVE Lab Manual Faculty Resource Center Faculty Site

Terms & Conditions of Use

Related Concept Videos

Yield Criteria for Ductile Materials under Plane Stress

Yield Criteria for Ductile Materials under Plane Stress

In designing structural elements and machine parts using ductile materials, it is crucial to ensure that these components withstand applied stresses without yielding. Yielding is initially determined through a tensile test, which evaluates the material's response to uniaxial stress. However, tensile stress is insufficient when components face biaxial or plane stress conditions This condition requires advanced criteria to predict failure.
The Maximum Shearing Stress Criterion, also known as...

You might also read

Related Articles

Articles linked to this work by shared authors, journal, and citation graph.

Sort by

Same journal

RETRACTED: Ndaguba et al. Operability of Smart Spaces in Urban Environments: A Systematic Review on Enhancing Functionality and User Experience. <i>Sensors</i> 2023, <i>23</i>, 6938.

Sensors (Basel, Switzerland)·2026

Same journalSame Topic

Correction: Ma et al. A Lightweight, Low-Frequency, Broadband Underwater Acoustic Transducer with Ternary Symmetric Excitation: Integrating KNN and Terfenol-D for Enhanced Performance. <i>2026</i>, <i>26</i>, 3645.

Sensors (Basel, Switzerland)·2026

Same journal

Correction: He et al. An Edge-Computing-Based Emotion-Aware Adaptive Lighting System for Intelligent Cockpits. <i>Sensors</i> 2026, <i>26</i>, 3489.

Sensors (Basel, Switzerland)·2026

Same journal

Correction: Tu et al. Lower Limb Motion Recognition with Improved SVM Based on Surface Electromyography. <i>Sensors</i> 2024, <i>24</i>, 3097.

Sensors (Basel, Switzerland)·2026

Same journal

Real-Time Detection System for Road Roughness Based on Ultrasonic Technology.

Sensors (Basel, Switzerland)·2026

Same journal

FedHSFV: Federated Learning for Finger Vein Recognition via Hierarchical Decoupling and Subspace Metric.

Sensors (Basel, Switzerland)·2026

Search research articles

Related Experiment Video

Updated: May 5, 2026

Using Synchrotron Radiation Microtomography to Investigate Multi-scale Three-dimensional Microelectronic Packages

Using Synchrotron Radiation Microtomography to Investigate Multi-scale Three-dimensional Microelectronic Packages

Published on: April 13, 2016

Analysis of Chip Electronic Components' Typical Yield in Taping Process Based on Virtual Metrology.

Shiqi Zhang¹, Lizhen Chen^1,2, Jiangcheng Fu^1,2

¹Institute of Electronic Products and Electrical Appliances, Guangdong Academy of Sciences, Guangzhou 510400, China.

Sensors (Basel, Switzerland)

|May 4, 2026

Summary

This study introduces a virtual metrology (VM) framework for electronic component taping, improving yield prediction stability by focusing on operating conditions. The data-centric approach enhances early warning systems for manufacturing processes.

Keywords:

Bayesian optimization imbalanced regression multidimensional equal-frequency binning nested cross-validation taping virtual metrology yield prediction

More Related Videos

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies

Published on: March 20, 2015

Making Record-efficiency SnS Solar Cells by Thermal Evaporation and Atomic Layer Deposition

Making Record-efficiency SnS Solar Cells by Thermal Evaporation and Atomic Layer Deposition

Published on: May 22, 2015

Related Experiment Videos

Last Updated: May 5, 2026

Using Synchrotron Radiation Microtomography to Investigate Multi-scale Three-dimensional Microelectronic Packages

Using Synchrotron Radiation Microtomography to Investigate Multi-scale Three-dimensional Microelectronic Packages

Published on: April 13, 2016

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies

Published on: March 20, 2015

Making Record-efficiency SnS Solar Cells by Thermal Evaporation and Atomic Layer Deposition

Making Record-efficiency SnS Solar Cells by Thermal Evaporation and Atomic Layer Deposition

Published on: May 22, 2015

Area of Science:

Manufacturing Process Control
Data Science in Engineering
Semiconductor Manufacturing

Background:

Virtual metrology (VM) faces challenges in electronic component taping due to partial observability and data imbalance.
Direct batch-wise yield prediction is unstable, hindering effective process monitoring.

Purpose of the Study:

To develop a data-centric VM framework for stable yield prediction in electronic component taping.
To reformulate the task as predicting operating-condition-level typical yield.

Main Methods:

Physically relevant features were identified using correlation and mutual information.
Multidimensional equal-frequency binning created operating condition groups.
A dictionary-based representation with low-yield-oriented sample weighting was employed.

Main Results:

The proposed VM framework demonstrated more stable predictions than direct modeling.
Improved tail-oriented fitting was observed compared to unweighted baselines.
Operating condition stratification stabilized VM prediction for partially observable data.

Conclusions:

Operating condition stratification provides a practical method for stabilizing VM prediction.
Low-yield-oriented sample weighting enhances sensitivity to low-yield conditions.
The framework supports early yield warning and informed process-level decision-making.