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Remote disassembly of electronics-free modular structures
Xinyi Yang1, Martin Nisser2, Victor Riera Naranjo1
1Daniel Guggenheim School of Aerospace Engineering, Georgia Institute of Technology, Atlanta, GA, USA.
Abstract:
This paper presents a scalable modular structure composed of cuboctahedral units that can be selectively disassembled using a single, remote vibration source. Each module features self-locking intra-connectors for load-bearing assembly, together with inter-connectors designed for geometrically programmable, vibration-triggered disassembly. Rather than requiring embedded electronics, our system leverages the propagation of mechanical waves to enable targeted detachment anywhere in the structure from a single vibration source. Mechanical testing reveals that external vibration reduces the effective friction coefficient at inter-connectors, providing the physical basis for their remote disassembly. Leveraging this insight, we construct a surrogate model that systematically maps connector geometry to their disassembly properties, thereby enabling inverse design of inter-connectors with tailored triggering power and release energy. We further demonstrate this remote disassembly protocol across diverse applications-including staged deployment, underwater disassembly, load-bearing collapse, and three-dimensional deployment in large structures-highlighting its robustness, simplicity, and suitability for responsive, electronics-free modular systems.
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