Construction of Ti₃C₂T_x MXene Composite PI Nanogel Fiber With Excellent Infrared Stealth Performance

Area of Science:

• Materials Science
• Nanotechnology
• Infrared Technology

Background:

• Growing demand for infrared stealth materials due to advancements in infrared detection.
• Need for integrated solutions combining thermal insulation and radiation modulation.
• Limitations of existing materials in high-temperature stealth applications.

Purpose of the Study:

• To fabricate a novel integrated infrared stealth material.
• To achieve effective thermal camouflage for high-temperature targets.
• To enhance oxidation stability of the stealth material.

Main Methods:

• Integration of polyimide (PI) aerogel fibers for thermal insulation.
• Incorporation of MXene/tannic acid composite for low emissivity and oxidation resistance.
• Characterization of thermal conductivity, emissivity, and thermal camouflage performance.

Main Results:

• The composite PI/SA/TM material achieved low thermal conductivity (0.084 W·m^-1·K^-1) and low emissivity (0.17).
• Demonstrated superior stealth performance at 200 °C, with a radiant temperature of 40.7 °C.
• Enhanced oxidation stability with retained low emissivity (0.24) after 15 days of humid heat aging.

Conclusions:

• The developed integrated material offers efficient thermal insulation and radiation modulation for infrared stealth.
• The material shows significant potential for thermal camouflage of high-temperature targets.
• This work provides a new design strategy for advanced functional infrared stealth materials.