Stress Engineering in the Optimization of Next-Generation Hafnium-Based Ferroelectric Memory

Hafnium oxide thin films have been extensively investigated for high-speed and low-power memory applications. Herein, we investigated the influence of oxygen vacancies and external stress on the ferroelectric characteristics of Al-doped HfO₂ (HfAlO). Compared with HfAlO with 14% oxygen vacancies, films with 21% oxygen vacancies could lower the polarization switching barrier and increase the fraction of the ferroelectric phase. Furthermore, significant external stress promotes ferroelectric phase formation, thereby enhancing ferroelectric characteristics. The remanent polarization achieved with W electrodes (2Pr = 38 µC/cm²) is about 18 times that of Au electrodes, owing to the lower thermal expansion coefficient of W electrodes. Density functional theory calculations and finite element analysis provide theoretical insights corroborating the experimental results, helping to pave the way for developing hafnium-based materials for next-generation in-memory computing applications.