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Progress and Challenges in Joining for Precision Endoscope Fabrication.
Peiquan Xu1, Xiaohao Zheng1, Leijun Li2
1School of Materials Science and Engineering, Shanghai University of Engineering Science, Shanghai 201620, China.
Sensors (Basel, Switzerland)
|May 13, 2026
Summary
This review addresses challenges in fabricating reliable endoscope joints by exploring materials, joining methods, and technical issues. It proposes strategies like thin-film engineering and laser-based joining to improve joint integrity and sterilization resistance for minimally invasive surgery devices.
Area of Science:
- Materials Science and Engineering
- Biomedical Engineering
- Manufacturing Processes
Background:
- Endoscopes are complex multi-material devices requiring robust joining techniques.
- Current joining methods face challenges with dissimilar materials, residual stress, and sterilization resistance.
- Degradation of joints can lead to device failure in clinical settings.
Purpose of the Study:
- To review base materials, joining methods, and technical challenges in endoscope fabrication.
- To propose strategies for enhancing joint reliability, especially under clinical constraints.
- To identify solutions for joining dissimilar materials in endoscopes for improved longevity.
Main Methods:
- Comprehensive literature search across multiple databases (Web of Science, Scopus, PubMed, etc.).
- Keyword-based retrieval focusing on endoscope joining, welding, sealing, soldering, and brazing.
- Analysis of 158 selected publications from 1950-2026 on materials, processes, and challenges.
Main Results:
- Endoscopes utilize diverse materials: biomaterials, optical components, plastics, ceramics, and coatings.
- Joining techniques include adhesive bonding, laser soldering/brazing, wave soldering, and fusion welding.
- Key challenges involve joining mismatched materials, reducing residual stress, and resisting sterilization/thermal degradation.
Conclusions:
- Synergistic thin-film engineering with silver anti-oxidation layers can improve joint hermeticity and reduce stress.
- Developing principles for multi-joining processes is crucial for integrating dissimilar materials.
- Laser-based joining offers precision control for heat input and bonding quality, minimizing damage to sensitive components.
