Janus Silica Microspheres-Reinforced Polymer-Based Composite Encapsulation Films with Enhanced Barrier and Mechanical

Yunle Yao1,2, Rui Pan1,2, Jiaping Zhang1,2

  • 1Key Laboratory of Photovoltaic and Energy Conservation Materials, Institute of Solid State Physics, Hefei Institutes of Physical Science, Chinese Academy of Sciences, Hefei, Anhui 230031, People's Republic of China.

Summary

Researchers developed advanced composite films using Janus silica microspheres for electronic device encapsulation. These materials significantly improve moisture barriers and mechanical flexibility, enhancing device reliability.

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