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Related Concept Videos

iChip01:24

iChip

The cultivation of environmental microorganisms has long been hindered by the inability to replicate complex native conditions in vitro. The isolation chip (iChip) addresses this limitation by facilitating the growth of previously uncultivable microorganisms through in situ incubation. Designed for high-throughput microbial cultivation, the iChip comprises hundreds of microchambers, each capable of housing a single microbial cell. These microchambers are loaded with a mixture of molten agar and...

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Related Experiment Video

Updated: May 21, 2026

Chronic Implantation of Multiple Flexible Polymer Electrode Arrays
08:54

Chronic Implantation of Multiple Flexible Polymer Electrode Arrays

Published on: October 4, 2019

A chip integration method for implantable devices based on structural embedding using cyclic olefin copolymer.

Taekyung Lee, Joowon Lee, Jisung Kim

    IEEE Transactions on Bio-Medical Engineering
    |May 19, 2026
    PubMed
    Summary
    This summary is machine-generated.

    This study introduces a novel chip integration method for implantable devices using structural embedding. This technique enhances reliability and space efficiency, crucial for long-term medical device function.

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    Last Updated: May 21, 2026

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    Published on: March 20, 2026

    Area of Science:

    • Biomedical Engineering
    • Materials Science
    • Microelectronics

    Background:

    • Chip integration in implantable devices faces challenges from fluid exposure, mechanical stress, and space limitations.
    • Current packaging methods can lead to reliability issues and fluid ingress.
    • Developing robust, space-efficient integration is critical for advanced medical implants.

    Purpose of the Study:

    • To present a new chip integration strategy using structural embedding with cyclic olefin copolymer (COC).
    • To evaluate the reliability and performance of embedded chips under conditions relevant to implantation.
    • To demonstrate a monolithic, space-efficient, and mechanically robust solution for implantable electronics.

    Main Methods:

    • Structural embedding of integrated circuit chips into a COC substrate using an inverse truncated pyramid (ITP) geometry.
    • Comprehensive testing including biocompatibility, electrical connectivity (with PEDOT:PSS reinforcement), mechanical/thermal reliability, long-term insulation, and functional validation.
    • Finite element analysis (FEA) to assess stress distribution and heat dissipation.

    Main Results:

    • Achieved 87% electrical connectivity yield after PEDOT:PSS reinforcement.
    • ITP geometry effectively redistributed mechanical stress and dissipated heat.
    • Demonstrated stable electrical insulation for 380 days, projecting a 14.5-year operational lifetime.
    • Embedded functional devices maintained stable electrical performance.

    Conclusions:

    • The structural embedding strategy enables monolithic, space-efficient, and mechanically robust chip integration.
    • The approach addresses key challenges for implantable device reliability.
    • This method offers a promising foundation for developing compact and dependable implantable devices with integrated electronics.