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Related Experiment Video

Updated: May 28, 2026

Challenges in Rheological Characterization of Highly Concentrated Suspensions — A Case Study for Screen-printing Silver Pastes
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High-Temperature Sintered Conductive Silver Paste with Optimized Structure and Performance: Formula Design and

Gang Liu1,2, Songlin Lu3, Pengpeng Chen3

  • 1Beijing Baimtec Material Co., Ltd., Beijing 100094, China.

Nanomaterials (Basel, Switzerland)
|May 26, 2026
PubMed
Summary
This summary is machine-generated.

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Researchers optimized high-temperature sintered conductive silver paste for electronics. The study details formulation and processing for improved electrical and mechanical properties, enhancing device reliability.

Area of Science:

  • Materials Science
  • Electrical Engineering
  • Nanotechnology

Background:

  • High-temperature sintered conductive silver paste is crucial for electronic components, impacting device reliability and integration.
  • Optimizing paste formulation and preparation is key to achieving desired electrical and mechanical properties.

Purpose of the Study:

  • To investigate the effects of formulation composition and preparation processes on conductive silver paste properties.
  • To determine optimal conditions for achieving low resistivity, good mechanical strength, and substrate adhesion.

Main Methods:

  • Ball milling was used to disperse silver powder, glass powder (binder), and ethyl cellulose (thickener) in an organic carrier.
  • Rheological, electrical, and mechanical properties of the paste and films were systematically evaluated.
Keywords:
conductive propertyrheological propertysilver paste

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Last Updated: May 28, 2026

Challenges in Rheological Characterization of Highly Concentrated Suspensions &#8212; A Case Study for Screen-printing Silver Pastes
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Challenges in Rheological Characterization of Highly Concentrated Suspensions — A Case Study for Screen-printing Silver Pastes

Published on: April 10, 2017

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  • Optimization involved varying sintering parameters, ball milling conditions, and organic carrier composition.

    • Main Results:

    • Sintering time/temperature and ball milling parameters significantly influenced paste resistance and particle size distribution.
    • Thixotropy was found to be a critical factor affecting resistance characteristics.
    • Optimal conditions yielded a paste with excellent shear-thinning behavior, low resistivity, superior bending resistance, and good adhesion.

    Conclusions:

    • The study successfully optimized high-temperature sintered conductive silver paste formulation and preparation.
    • Achieved low resistivity, enhanced mechanical properties, and good substrate adhesion are vital for advanced electronic applications.
    • Findings offer valuable insights for designing high-performance conductive silver pastes.