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High-Temperature Sintered Conductive Silver Paste with Optimized Structure and Performance: Formula Design and

Gang Liu^1,2, Songlin Lu³, Pengpeng Chen³

¹Beijing Baimtec Material Co., Ltd., Beijing 100094, China.

Nanomaterials (Basel, Switzerland)

|May 26, 2026

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Researchers optimized high-temperature sintered conductive silver paste for electronics. The study details formulation and processing for improved electrical and mechanical properties, enhancing device reliability.

Area of Science:

Materials Science
Electrical Engineering
Nanotechnology

Background:

High-temperature sintered conductive silver paste is crucial for electronic components, impacting device reliability and integration.
Optimizing paste formulation and preparation is key to achieving desired electrical and mechanical properties.

Purpose of the Study:

To investigate the effects of formulation composition and preparation processes on conductive silver paste properties.
To determine optimal conditions for achieving low resistivity, good mechanical strength, and substrate adhesion.

Main Methods:

Ball milling was used to disperse silver powder, glass powder (binder), and ethyl cellulose (thickener) in an organic carrier.
Rheological, electrical, and mechanical properties of the paste and films were systematically evaluated.

Keywords:

conductive property rheological property silver paste

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Optimization involved varying sintering parameters, ball milling conditions, and organic carrier composition.

Main Results:

Sintering time/temperature and ball milling parameters significantly influenced paste resistance and particle size distribution.
Thixotropy was found to be a critical factor affecting resistance characteristics.
Optimal conditions yielded a paste with excellent shear-thinning behavior, low resistivity, superior bending resistance, and good adhesion.

Conclusions:

The study successfully optimized high-temperature sintered conductive silver paste formulation and preparation.
Achieved low resistivity, enhanced mechanical properties, and good substrate adhesion are vital for advanced electronic applications.
Findings offer valuable insights for designing high-performance conductive silver pastes.