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Kailin Luo1, Sijing Chen1, Hai Li1
1SEU-FEI Nano-Pico Center, Key Laboratory of MEMS of Ministry of Education, School of Integrated Circuits, Southeast University, Nanjing 210096, China.
Predicting microscale material removal wear is challenging due to multiple loss pathways. This review analyzes wear models, highlighting that selecting the right model based on the active wear mechanism and contact state is most reliable.
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