Comparative Evaluation of Optical Alignment Algorithms for Integrated Probe Cards in Photonic Wafer Testing

Wafer-level testing of Photonic Integrated Circuits (PICs) represents a critical throughput bottleneck in silicon photonics manufacturing, particularly as co-packaged optics demand testing of thousands of optical I/O per wafer. This work introduces optimized alignment algorithms for the Technoprobe Eclipse Dynamic probe card system, which integrates electrical probes and a piezoelectrically actuated fiber array unit within a single probe head, eliminating external positioning equipment. We systematically evaluate seven alignment algorithms: Reference Coarse Scan, Reference Coarse+Fine Scan, Cross Scan, Local and Global Bayesian Optimization, Variable and Fixed Gradient Ascent. The evaluation is made across 72 simulated test cases derived from eight experimental datasets through systematic spatial windowing, combined with experimental validation. Performance is assessed under four operating regimes-high-speed (HS) and low-speed (LS) operation, each with or without hysteresis compensation (H/NH). Experimental validation across eight die positions confirms 100% success rate for both Local Bayesian (98.24% accuracy in 99.87 arbitrary units (a.u.)) and Fixed Gradient (99.18% accuracy in 154.01 a.u.) baseline algorithms. Comprehensive simulation results with improved algorithms across all four scenarios reveal distinct performance characteristics. Fixed Gradient achieves the highest reliability (95.8%) with 99.4% average accuracy across all operating conditions. Variable Gradient provides the fastest alignment (1.18 a.u. in HS-NH) with 90.3% reliability. Local Bayesian demonstrates 94.4% reliability with intermediate performance. Global Bayesian Optimization achieves the best sample efficiency (average 24 steps) but exhibits scenario-dependent reliability ranging from 88.9% (HS-H, LS-H) to 93.1% (LS-NH). For the ideal production scenario, high speed with effective hysteresis compensation (HS-NH), Fixed Gradient emerges as the optimal choice, delivering 95.8% reliability with 1.44 a.u. alignment time, resulting in the best success rate while being nearly as fast as the fastest method. Variable Gradient achieves the absolute fastest alignment (1.18 a.u.) but with 5.5% lower reliability (90.3%), making it suitable only for applications tolerating higher failure rates. Under realistic production conditions with uncompensated hysteresis (HS-H), Fixed Gradient maintains its advantage (95.8% reliability, 3.32 a.u.), while Global Bayesian degrades significantly (88.9% reliability, 4.29 a.u.). Statistical analysis using data profiles validates these methods for high-volume PIC manufacturing, with the Eclipse Dynamic system demonstrating per-die optical alignments in sub-second timescales using open-loop control hardware.