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Related Experiment Video

Updated: May 28, 2026

Design and Optimization Strategies of a High-Performance Vented Box

Design and Optimization Strategies of a High-Performance Vented Box

Published on: June 9, 2023

Multi-Objective Optimization for Through-Silicon via Structure Considering Thermomechanical Reliability and

Siyi Chen¹, Wanlu Hu^1,2, Song Xue¹

¹School of Mechano-Electronic Engineering, Xidian University, Xi'an 710071, China.

|May 27, 2026

Summary

This summary is machine-generated.

This study optimizes Through-Silicon Via (TSV) structures for advanced electronic packaging. Advanced algorithms enhance thermomechanical reliability and electrical performance in high-density designs.

Keywords:

2.5D package homogenization equivalence multi-objective optimization thermomechanical reliability analysis through-Si-via transmission characteristics

Related Experiment Videos

Last Updated: May 28, 2026

Design and Optimization Strategies of a High-Performance Vented Box

Design and Optimization Strategies of a High-Performance Vented Box

Published on: June 9, 2023

Area of Science:

Materials Science
Electrical Engineering
Mechanical Engineering

Background:

High-performance computing drives demand for advanced electronic packaging.
Through-Silicon Vias (TSVs) are key for miniaturization and integration but face reliability challenges.
Coefficient of thermal expansion mismatches and parasitic effects impact TSV performance.

Purpose of the Study:

Investigate thermomechanical reliability and electrical performance of TSV structures.
Address cross-scale challenges in 2.5D package structures.
Optimize TSV parameters for enhanced reliability and electrical characteristics.

Main Methods:

Developed a macro-micro model using Representative Volume Element (RVE) homogenization and sub-model techniques.
Created an equivalent circuit model based on transmission line network theory, validated by electromagnetic simulations.
Employed an improved multi-objective grasshopper algorithm (IMOGOA) and genetic algorithm back propagation network (GA-BP) for co-optimization.

Main Results:

Successfully modeled and analyzed the thermomechanical and electrical behavior of TSV structures.
Validated the equivalent circuit model for accurate signal transmission analysis.
Achieved simultaneous enhancement of thermomechanical reliability and electrical characteristics through co-optimization.

Conclusions:

The proposed co-optimization approach provides a practical solution for improving high-density integrated packaging.
Offers valuable insights for future electronic packaging design and optimization.
Enhances the reliability and performance of Through-Silicon Via (TSV) technology.