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Related Experiment Video

Updated: May 28, 2026

Ohmic Contact Fabrication Using a Focused-ion Beam Technique and Electrical Characterization for Layer Semiconductor Nanostructures

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A Low-Stray-Inductance 1200 V/500 A SiC Power Module Based on Multilayer Insulated Metal Substrate.

Youyuan Yue^1,2, Liming Che^1,2, Cancan Li^1,2

¹Institute of Future Lighting, College of Intelligent Robotics and Advanced Manufacturing, Fudan University, Shanghai 200433, China.

|May 27, 2026

Summary

This summary is machine-generated.

This study introduces a novel multilayer insulated metal substrate (MIMS) power module design to reduce stray inductance in wide band gap (WBG) semiconductors. The MIMS design significantly lowers inductance and improves thermal performance for high-power electronics.

Keywords:

high-thermal-conductive epoxy insulated metal substrate (IMS)multilayer laminated substrate mutual-inductance cancelling silicon carbide (SiC)stray inductance transient thermal performance

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Last Updated: May 28, 2026

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Area of Science:

Materials Science
Electrical Engineering
Semiconductor Physics

Background:

Wide band gap (WBG) semiconductors like silicon carbide (SiC) and gallium nitride (GaN) are crucial for high-power density and efficiency.
High switching speeds in WBG devices exacerbate issues with stray inductance from packaging, leading to voltage overshoot and oscillations.
Mitigating stray inductance is critical for reliable and efficient operation of power electronic modules.

Purpose of the Study:

To propose a novel power module design utilizing a multilayer insulated metal substrate (MIMS) structure.
To address and mitigate the detrimental effects of stray inductance in WBG power electronics.
To evaluate the electrical and thermal performance improvements offered by the proposed MIMS design.

Main Methods:

A power module design based on a multilayer insulated metal substrate (MIMS) was developed.
A fabrication process flow with high feasibility was designed for the MIMS module.
Electrical and thermal simulations were performed on a 1200 V, 500 A power module.
The proposed design's performance was compared against a conventional planar module and a hybrid module.

Main Results:

The proposed MIMS power module demonstrated significantly lower stray inductance (3.47 nH) compared to the planar module (14.85 nH).
The MIMS design leverages a mutual-inductance cancelling effect to reduce parasitic inductance.
Transient thermal simulations showed the MIMS module has a 141.7% higher time constant than a hybrid module, indicating superior thermal management.

Conclusions:

The proposed MIMS power module design effectively mitigates stray inductance concerns in WBG power electronics.
The design offers substantial improvements in both electrical (reduced inductance) and thermal performance.
The MIMS module is well-suited for applications demanding high-constant power output and enhanced reliability.