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Mechanistic Structure-Property Relationships in Carbon/Polymer Composites: Connectivity, Junction Resistance, and
Sachin Kumar Sharma1, Reshab Pradhan1, Lokesh Kumar Sharma2
1Surface Science and Tribology Lab, Department of Mechanical Engineering, Shiv Nadar Institution of Eminence, Gautam Buddha Nagar 201314, India.
Carbon/polymer composites offer advanced functionalities like electrical transport and sensing. Their performance hinges on microstructure control, not just filler content, for applications in thermal management and EMI shielding.
Area of Science:
- Materials Science
- Polymer Composites
- Nanomaterials
Background:
- Carbon/polymer composites are engineered for multifunctionality, including mechanical reinforcement, electrical/thermal transport, electromagnetic interference (EMI) shielding, and sensing.
- Material performance is dictated by network topology, junction resistance, and interfacial thermal resistance, influenced by processing conditions, rather than solely filler content.
Purpose of the Study:
- To review structure-processing-property relationships in carbon/polymer composites.
- To provide application-driven design rules for sensors, EMI shielding, and thermal management.
Main Methods:
- Analysis of electrical and thermal transport mechanisms, including percolation theory and Kapitza resistance.
- Examination of advanced carbon architectures (hybrid, 3D) and scalable manufacturing routes (masterbatch extrusion, additive manufacturing).
- Consolidation of mechanistic understanding of structure-processing-property relationships.
Main Results:
- Electrical conductivity exhibits nonlinear behavior near the percolation threshold, enabling high piezoresistive sensitivity.
- Thermal transport is often limited by interfacial and junction resistances, hindering the full potential of carbon nanomaterials.
- Hybrid and 3D carbon architectures improve connectivity and reduce losses, allowing for programmable anisotropy.
Conclusions:
- Optimizing carbon/polymer composites requires coupled control over microstructure, processing, and interfaces.
- Scalable manufacturing routes are advancing, but challenges in dispersion, durability, and transport-toughness trade-offs remain.
- This review offers design principles for enhanced composite performance in sensing, EMI shielding, and thermal management.
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