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Updated: May 31, 2026

Multi-Modal Signals for Analyzing Pain Responses to Thermal and Electrical Stimuli
Published on: April 5, 2019
Bimodal Thermoelectric/AIE E-Skin Decouples Contact-Area Ambiguity for Concurrent Pain Perception and Injury Mapping
Bingchen Huo1,2, Fengxia Kuang1,2, Chunyu Du1
1College of Materials Science and Engineering, Shenzhen University, Shenzhen, P. R. China.
Abstract:
Thermoreceptive electronic skins face fundamental limitations due to signal ambiguity caused by the contact-area effect in thermoelectric devices. Since electrical output depends on total heat flux, localized high-temperature stimuli generate indistinguishable signals from widespread low-temperature stimuli, leading to unreliable thermal hazard assessment. To address this challenge, we developed a dual-modality bilayer e-skin integrating a single-walled carbon nanotube-based thermoelectric layer and an aggregation-induced emission luminogen-based photoluminescent layer. The bottom thermoelectric layer functions as a fast-response nociceptor, converting temperature gradients into voltage-encoded "pain" signals. The top AIE layer provides contact-area-independent optical mapping of thermal fields through photoluminescence quenching, enabling direct visual decoupling of temperature from contact area without computational processing. This integrated platform achieves real-time injury visualization, accurate temperature recognition (>97% accuracy), and reliable nociceptive-like sensing. Validated by a biomimetic robotic reflex system, the e-skin offers a robust solution for intelligent safety protection and enhanced human-machine interaction in dynamic thermal environments.
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