Related Experiment Video
Updated: Jun 4, 2026

Thermal Measurement Techniques in Analytical Microfluidic Devices
Published on: June 3, 2015
Thermal Utilization on Chip
Yaohao Zhang1,2, Bo Lai1, Fei Yu2
1State Key Laboratory of Luminescence Science and Technology, Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences, Changchun, China.
Abstract:
The integration and miniaturization of chips lead to significant power consumption and heat accumulation. Typically, the energy consumption of cooling systems accounts for morn than 50% of the input energy. Current thermal management technologies do not offer solutions for on-chip thermal energy loss. Herein, we propose an on-chip integrated thermal recovery system, which can simultaneously achieve efficient heat dissipation. Present system on chips is based on hydrovoltaic generator technology, consisting of electrodes and gel. With the deep ultraviolet LED (236 nm) chip suffering from severe heat accumulation as a prototype, upon integration with the thermal recovery system, not only maintain the chip temperature below 40 °C, but also converts waste heat into stored electrical energy, resulting in a 610.70% improvement in overall energy utilization efficiency. To demonstrate its general applicability in commercial CPU systems, we used the commercial Intel G3220 chip and as an example, by incorporating four HEG units, the temperature was reduced from 93 °C to below 60 °C, effectively enhancing computational performance and extending the chip's lifespan.
Related Concept Videos
Thermal Stress
Non-ohmic Devices
Consider a simple circuit consisting of a battery, a diode, and a resistor. A diode...
Thermal expansion and Thermal stress: Problem Solving
To solve the problem, first, identify the known and unknown quantities. The initial length (L) of the bridge is 1275 m, the coefficient of linear expansion (α) for steel is 12 x 10-6/°C, and the change in temperature (ΔT) is 55 °C.
Mechanism of heat transfer
Thermal Strain
iChip
