Electrospun collagen/hyaluronic acid dressing co-loaded with EGF and bFGF for enhanced diabetic wound healing

Chronic non-healing wounds are a major complication of diabetes and require advanced therapeutic strategies. Although epidermal growth factor (EGF) and basic fibroblast growth factor (bFGF) are known to promote tissue regeneration, their poor stability and short half-life have severely restricted clinical translation. To overcome these challenges, a collagen/hyaluronic acid dressing loaded with EGF and bFGF (CH-EGF/bFGF) was prepared via electrospinning. CH-EGF/bFGF exhibited a fibrous network-like entanglement and possessed good water retention and mechanical properties. In vitro experiments, it was observed that CH-EGF/bFGF not only had good biosafety but also promoted the adhesion, proliferation, and migration of HaCaT cells through activation of the ERK1/2 and p38 MAPK signaling pathways. Furthermore, CH-EGF/bFGF effectively accelerated the wound-healing process in db/db diabetic mice, and markedly enhanced the expression of vascular endothelial growth factor, Ki67, CD31, alpha-smooth muscle actin, collagen I, and collagen III at the wound site. This study achieves dual growth factor stabilization and controlled release through an electrospun biomimetic matrix that simultaneously mimics the extracellular matrix and maintains a moist wound-healing milieu. In conclusion, CH-EGF/bFGF demonstrated promising potential for promoting diabetic wound healing, offering a novel and viable therapeutic approach for the clinical management of diabetic wounds.