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Related Concept Videos

Hybridization of Atomic Orbitals I03:24

Hybridization of Atomic Orbitals I

The mathematical expression known as the wave function, ψ, contains information about each orbital and the wavelike properties of electrons in an isolated atom. When atoms are bound together in a molecule, the wave functions combine to produce new mathematical descriptions that have different shapes. This process of combining the wave functions for atomic orbitals is called hybridization and is mathematically accomplished by the linear combination of atomic orbitals. The new orbitals that...
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sp3d and sp3d 2 Hybridization
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In addition to the oxymercuration–demercuration method, which converts the alkenes to alcohols with Markovnikov orientation, a complementary hydroboration-oxidation method yields the anti-Markovnikov product. The hydroboration reaction, discovered in 1959 by H.C. Brown, involves the addition of a B–H bond of borane to an alkene giving an organoborane intermediate. The oxidation of this intermediate with basic hydrogen peroxide forms an alcohol.
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A significant aspect of hydroboration–oxidation is the regio- and stereochemical outcome of the reaction.
Hydroboration proceeds in a concerted fashion with the attack of borane on the π bond, giving a cyclic four-centered transition state. The –BH2 group is bonded to the less substituted carbon and –H to the more substituted carbon. The concerted nature requires the simultaneous addition of –H and –BH2 across the same face of the alkene giving syn stereochemistry.
Valence Bond Theory and Hybridized Orbitals02:38

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According to valence bond theory, a covalent bond results when: (1) an orbital on one atom overlaps an orbital on a second atom, and (2) the single electrons in each orbital combine to form an electron pair. The strength of a covalent bond depends on the extent of overlap of the orbitals involved. Maximum overlap is possible when the orbitals overlap on a direct line between the two nuclei.
A σ bond (single bond in a Lewis structure) is a covalent bond in which the electron density is...
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Electrophilic addition of halogens to alkenes proceeds via a cyclic halonium ion to form a 1,2-dihalide or a vicinal dihalide.

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Substrate-Induced One-Dimensional Borophene-Silver Hybridization.

Qian Gao1, Wenbin Li2,3, Caiyun Chen2,3

  • 1College of Information Science and Engineering, Shandong Agricultural University, Tai'an 271000, People's Republic of China.

Journal of the American Chemical Society
|June 6, 2026
PubMed
Summary
This summary is machine-generated.

Researchers created a new interface between 2D borophene and 1D silver chains, forming polar covalent bonds. This novel contact improves electron injection for 2D materials, paving the way for advanced electronic devices.

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Area of Science:

  • Materials Science
  • Condensed Matter Physics
  • Surface Science

Background:

  • Device performance is limited by contacts between 2D materials and metal electrodes.
  • Covalent bonding offers a potential solution for improved 2D material-metal interfaces.

Purpose of the Study:

  • To fabricate and characterize a novel interface between 2D borophene and 1D silver chains.
  • To investigate the atomic structure and electronic properties of this interface.
  • To explore a substrate-enabled pathway for engineering 2D material/metal contacts.

Main Methods:

  • Fabrication of a borophene/silver chain interface on an Ag(111) surface.
  • Atomic structure identification using scanning tunneling microscopy (STM).
  • Electronic structure analysis using density functional theory (DFT).

Main Results:

  • Identified a 4-fold superlattice modulation at the interface due to compressive strain.
  • Revealed charge transfer and the formation of polar covalent silver-boron (Ag-B) bonds.
  • Demonstrated efficient electron injection, characteristic of Ohmic contacts.

Conclusions:

  • Established a stress-driven pathway for creating atomically precise 2D material/metal interfaces.
  • The novel interface serves as a model for exploring low-dimensional quantum phases.
  • This work provides fundamental insights into interface engineering for advanced electronic applications.