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Crack-Free Precision during Desiccation: Optimizing Aerosol Jet Printing for High-Performance Conductive

Geng Li^1,2, Yuxin Sun¹, Yanhong Tian¹

¹State Key Laboratory of Precision Welding & Joining of Materials and Structures, Harbin Institute of Technology, Harbin 150001, China.

|June 8, 2026

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This summary is machine-generated.

Aerosol jet printing (AJP) can cause cracks in conductive lines, reducing performance. Optimizing deposition thickness and resolution prevents cracks, creating high-quality, conductive silver lines for electronics.

Area of Science:

Additive Manufacturing
Materials Science
Surface Science

Background:

Aerosol jet printing (AJP) is a versatile high-resolution additive manufacturing technique.
Cracking in printed conductive lines is a major limitation, affecting electrical and structural properties.

Purpose of the Study:

To investigate the desiccation-induced cracking mechanism in AJP.
To develop optimization strategies for mitigating cracks and enhancing conductivity in printed silver lines.

Main Methods:

Analysis of crack morphology and distribution in AJP-printed lines.
Implementation of controlled deposition thickness and enhanced resolution.
Minimization of overspray during the printing process.

Keywords:

Additive manufacturing Aerosol jet printing Conductive microstructure Desiccation cracking Suction stress

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Main Results:

Identified deposition thickness and overspray as key factors influencing crack formation.
Achieved crack-free, high-quality silver lines through optimized printing parameters.
Demonstrated superior electrical conductivity in the optimized printed lines.

Conclusions:

Understanding desiccation-induced cracking is crucial for reliable AJP.
Optimized AJP parameters significantly improve the quality and conductivity of printed silver lines.
This research advances the development of conductive structures for conformal and microelectronics.