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Updated: Jun 10, 2026

Fabrication of Flexible Image Sensor Based on Lateral NIPIN Phototransistors
Published on: June 23, 2018
Stretchable high-fill-factor silicon-liquid metal platform for multilevel visual acquisition and depth sensing
Chansul Park1,2, Do Hyeon Kim3, Woosang You1,2
1Center for Nanoparticle Research, Institute for Basic Science (IBS), Seoul, Republic of Korea.
Abstract:
High-density stretchable pixelated electronics that conform to complex, non-developable surfaces are key enablers of next-generation robotic vision systems, skin-mountable sensors and wearable electronics. Existing strategies for stretchable pixelated device arrays-such as buckling mechanics, pop-up structures, serpentine interconnects and kirigami designs-have offered partial solutions. However, a strategy that simultaneously achieves high device performance, stretchability, fill factor and integration density has remained elusive. Here we present a next-generation platform for stretchable pixelated electronics that integrates high-performance single-crystalline silicon pixels with finely patterned liquid metal interconnects on ultrathin elastomeric substrates. We developed a monolithic microfabrication strategy that enables customizable, densely packed and mechanically compliant pixelated device arrays. Using this platform, we demonstrate shape-reconfigurable imaging devices that achieve superb fill factors of up to 81% and a biaxial stretchability of 100%. We also present a human-eye-inspired robotic vision system with tunable focus and a skin-mountable lens-free imaging system. The complementary operation of retinal and epidermal imaging systems enables multiscale visual acquisition and depth sensing.
